IC Packaging
Caliber Interconnects is one of the leading providers of IC package design services for various sectors such as the communication, computing, consumer & automotive industries. Our services include flip-chip, wire bond, stacked-die, System-in-Package (SiP), Package-on-Package (PoP), Package-in-Package (PiP), Chip-Scale-Package (CSP), Chiplet designs & QFN assembly services.
We at Caliber provide different types of IC packages and vertical space transformers (MLO/MLC/LTCC/hybrid-interconnection substrates) for ATE testing applications, high-speed digital package of ICs, mixed-signal ICs and RFIC products. Our engineers have a high degree of expertise in signal integrity and power integrity analysis with a strong capability to perform Simultaneous Switching Noise (SSN) SI/PI simulations and parasitic package extractions. Using the latest Ansys, we also perform system-level SI timing analysis and power integrity optimization. We coordinate with the assembly house and substrate foundry to achieve the right substrate the first time and also make strict adherence to assembly specifications. Our process includes the validation of design for fab house DFM specification with our experienced CAM team.
Our Strengths
Advanced Tools
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SIP4150SPB Allegro
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SIP226SPB APD SiP layout option
Design/Analysis and Layout Teams
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More than 1250+ package designs successfully completed
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Layer count from 1-2-1 for Wirebond, 8-2-8 for flipchip up to 15-24-15 for MLO and 58 ceramic layers for MLC designs
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Low cost 4 layers laminates
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Multi layer ceramic designs
Cost-Effective and Timely Completion
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Lead Time 1 to 3 weeks from frozen netlist based on complexity
ABOUT US
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Our Specialties
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Design Tools: Mentor and Allegro package designer, Cadence Sigrity tools and Altium designer
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Thermal and Mechanical Aspects of Package Design
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Flip-chip BGA, wire-bond BGA, Chiplet designs, Stacked die packages, CSP, PoP, PiP, MLO/MLC package for ATE hardware
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SiP design for various applications including cellular, Bluetooth, WLAN, GPS, camera, PDA, and CMOS sensor
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Early-stage SI & PI analysis and optimization
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IC/Package/Board co-design flow
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SSN analysis based on SI/PI, co-design flow using SPICE netlist
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Package RLC extraction & package model generation for SI/PI analysis
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Power integrity and decoupling cap optimization
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Thermal & mechanical design
Our Capabilities
High-Speed Design and Analysis Services
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SiP designs
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Flipchip and Wirebond designs
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Chiplet designs
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Stacked die packages
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Multi-Chip Modules (MCMs) designs
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MLO/MLC/Coreless/Hybrid Substrate designs, Interposers for probe cards designs
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Chip Scale Package designs
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LTCC & HTCC designs
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Specialized in design services for medical and defense sectors
Tool Expertise:
We have expertise in the following tools:
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- Cadence APD, PCB Editor-Cadence SIP
- Autocad for POD & Mechanical drawings
- CAM 350 and Genesis for validating gerbers
- Mentor Expedition up to 2.14
- In-house tools & skills
- Altium designer