IC PACKAGE DESIGN
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Caliber offers IC package design services for package design technologies such as flip-chip, wire-bond, stacked-die, System-in-Package (SiP), Package-on-Package (PoP), Package-in-Package (PiP), Chip-Scale-Package (CSP) and other vertical space transformers (MLO/MLC) meant for ATE testing applications. We offer package solutions for high - speed digital ICs, mixed-signal ICs and RFIC products.

Package design has become very complex with ever- increasing data - rates and shrinking IC fabrication process technology (40nm, 28nm, 20nm, 12nm etc.). This requires high degree of expertise and careful signal integrity & power integrity analysis within IC/Package co - design environment. We have strong capability to perform simultaneous - switching - noise (SSN) SI/PI simulations, parasitic package extractions, System - level SI timing analysis and Power integrity optimization using the latest Ansys and Cadence sigrity tools. We also take care of the thermal and mechanical aspect of package design.

  • Flip-Chip, BGA, Wire-bond BGA, Chip-Scale-Package (CSP), Package-on-Package (PoP), Package-in-Package (PiP) design, MLO/MLC package for ATE hardware.
  • System-in-Package (SiP) design for applications such as Cellular, Bluetooth, WLAN, GPS, Camera, PDA and CMOS sensor.
  • Signal Integrity & Power Integrity analysis & optimization during early stage of package design.
  • IC/Package/board co - design flow.
  • Strong interaction with all stakeholders in the package design process.
  • SSN analysis based on SI/PI, co - design flow using the SPICE netlist.
  • Package RLC extraction & package model generation for SI/PI analysis.
  • Power Integrity and decoupling cap optimization.
  • Design tools – Mentor Package designer and Allegro Package designer.
  • Thermal & Mechanical design.
  • Coordination with assembly-house and substrate foundry to achieve the first- time right substrate.
  • Strict adherence to assembly specifications.
  • Experienced CAM team validates the design for Fab house DFM specification.
LEADING PROVIDER OF HIGH SPEED DESIGN AND ANALYSIS SERVICES FOR:
  • Probe Cards.
  • System in Packages (SiP).
  • Multi-Layer Package Designing and Layouts.
  • Multi Chip Modules (MCMs).
  • MLO/MLC Substrate Designs.
HIGHLY SKILLED DESIGN/ANALYSIS AND LAYOUT TEAM:
  • More than 800+ package designs successfully completed.
  • Organic build up from 1-2-1 to 8-2-8 layers.
  • Low Cost 4 layers Laminates.
  • Multi layer Ceramic designs.
  • Experience in wirebond and flip chip design and layout techniques.
  • Chip Scale Package designs.
Cost - Effective And Timely Job Completion

Lead Time 1.5 weeks to 3 weeks from frozen netlist based on complexity.

IC PACKAGE DESIGN

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We are a Product Engineering Company with a proven track record of offering Integrated product engineering solutions for major global players of diverse industries like Semiconductor, Avionics, Railways, Industrial, IOT (Internet of Things).