Embedded Solutions

SI / PI for IC / Package / Board

SI / PI : Optimize Your Design For Maximum Efficiency

SI/PI Analysis & Measurements

Signal Integrity (SI)

Interconnects operating at high frequency and fast switching rates require thorough signal (SI) and power integrity (PI) analysis to get designs right the first time. Caliber have strong knowledge in SI theory and expertise in simulation tools to analyze various issues like reflection due to impedance mismatch, crosstalk, signal attenuation and PDN noise. The analysis is carried out in the pre and post layout stages at both IC Package/substrate and board levels.

Post Layout Analysis

Simulations of the routed board for potential issues like reflection, overshoot/undershoot, crosstalk, attenuation, EMI and PDN issues. A post layout report is prepared from simulation results along with suggestions for topology modification, termination schemes and layout modification to achieve optimal signal and power integrity.

High Speed Channel Modeling

Modeling services for IC packages, HDI PCBs, Back-planes, Add-in cards, Via breakouts, connectors, socket/pogo pins, probes and cables

Expertise in advanced 3D tools from Ansys & Sigrity enables highly accurate models

End to End / system-level channel modelling and optimization for better performance

Expertise in SERDES design & simulations. Skilled in tuning/using the FFE, CTLE and DFE parameters in IBIS-AMI model based simulations

Maximum speed achieved is 112Gbps (PAM4) in production level. 116Gbps (PAM4) in prototype

PCB/Package - Signal Integrity Analysis

Reflection, ringing and overshoot/undershoot

Single ended and differential crosstalk analysis

Signal attenuation due to IR-Drop, skin-effect and dielectric loss

Channel analysis for serial communication – eye diagram analysis

IBIS/IBIS-AMI based system level simulations

Clock analysis (common & source synchronous)

DDR timing analysis

S - parameter analysis

  • Return & insertion loss, NEXT and FEXT analysis
  • Mixed mode analysis channel (common & differential)

Coupling analysis – Single and differential

Co - design (IC/package/board)

Power Integrity Analysis (PI)


IR - Drop

Power distribution network impedance profile

Transient noise estimation

Parasitic RLGC extraction

De-Coupling capacitors estimation and placement optimization

EMI/EMC Analysis

Net - wise radiated EMI

EMC analysis based on FCC, CISPR and VCCI requirement

Interfacing Technologies

Simulation capabilities & experience :

GDDR, DDR 3 & 4, LPDDR4/x, UFS & eMMC

PCIe Gen 3, 4 and 5


USB 3.1 & 3.2, SATA, C-phy


QSFP/SFP optical modules

Firefly connectors

112 Gbps channel simulation

Up to 100GHz RF channels

Analysis Tools Expertise

Cadence Sigrity

Keysight ADS

Siemens Hyperlynx

Ansys Siwave

Ansys HFSS


Advanced Tools

SYS942 - Clarity IC package extraction suite

SIGR302 - Sigrity power SI II

SYS103 - Celcius power DC

Thermal Analysis

PCB & IC package sizes are shrinking, so the components and the interconnects are becoming denser, which results in thermal issues. And also the power rating is increasing due to higher functionalism which also results in thermal issues. Performing precise thermal analysis helps us to increase component reliability, ensure proper material selection, reduce the possibility of the thermal failure and guarantee the electrical performance CIS uses different thermal analysis tools to foresee the factor affecting interconnect performance and proposes cost effective solutions to overcome deep thermal effects by analyzing thermal boundary conditions and power dissipation at IC package, board and system levels. 

Thermal Analysis-Parameters

Local ambient temperature of the component

Airflow over component

Physical constraints

Power dissipation of the component

Size of component

Packaging materials

Type of interconnections

Presence of thermal cooling system

Thermal conductivity

Power density of the substrate/ package, nearby component and circuit board to which it is attached


The temperature distributions plots

The amount of heat lost or gained plots

Thermal gradient plots

Thermal fluxes plots

Thermal conductivity plots

Fusion current density